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DSILC6-4XX ESD Protection for high speed interface Main applications Where transient over-voltage protection in ESD sensitive equipment is required, such as: I/O3 VCC I/O4 I/O2 GND I/O1 Computers Printers Communication systems Cell phone handsets and accessories Video equipment SOT-666 DSILC6-4P6 Flip-Chip DSILC6-4F2 Functional diagram Description The DSILC6-4XX is a monolithic application specific discrete dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet, display and camera serial interfaces (LVDS). I/O4 VCC I/O3 I/O1 VCC I/O2 I/O4 I/O1 GND I/O2 GND I/O3 The device is ideal for applications where both reduced printed circuit board space and power absorption capability are required. SOT-666 Top-side view Flip-Chip Top-side view Features Diode array topology I/O1 I/O4 VCC GND I/O2 I/O3 4 line protection 5 V VCC protection Very low capacitance: 1 pF typ. Lead-free pacakge RoHS compliant Flip-Chip Top-side view Order Code Part Number DSILC6-4P6 DSILC6-4F2 Marking G EI Benefits Very low capacitance between lines to GND for optimized data integrity Low PCB space consumption: 2.9 mm max for SOT-666 and 1.5 mm max for Flip-Chip Cut-off frequency > 2 GHz High reliability offered by monolithic integration MDDI, SMIA, MIPI specification compliant Complies with the following standards: IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class 3B May 2007 Rev 3 1/11 www.st.com 11 Characteristics DSILC6-4XX 1 Table 1. Symbol VPP IPP PPP Tstg Tj TL Characteristics Absolute ratings Parameter Peak pulse voltage Peak pulse current Peak pulse power Storage temperature range Maximum junction temperature Lead solder temperature (10 seconds duration) IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge SOT-666 I/O to GND Pulse waveform = 8/20 s SOT-666 Flip-Chip Flip-Chip Value 8 15 5 7 90 120 -55 to +150 125 260 Unit kV A W C C C Table 2. Symbol VRM IRM VBR VF VCL IPP Electrical characteristics (Tamb = 25 C) Parameter Reverse stand-off voltage Leakage current Breakdown voltage Forward voltage Clamping voltage Peak pulse current Value Symbol IRM VBR VF Parameter Leakage current VRM = 5 V 6 1 SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip 2 2.5 1.5 1.8 1.0 1.25 0.75 0.9 2.5 3 1.8 2.0 1.25 1.5 0.9 1.20 0.06 0.05 pF Test Conditions Min Typ Max 0.5 A V V Unit Breakdown voltage I = 1 mA between VBUS and GND R Forward voltage IF = 10 mA VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV Capacitance between Ci/o-GND I/O and GND Ci/o-i/o Capacitance between I/O Ci/o-GND Ci/o-i/o 2/11 DSILC6-4XX Characteristics Figure 1. Relative variation of leakage current versus junction temperature - SOT-666 (typical values) Figure 2. Relative variation of leakage current versus junction temperature Flip-Chip (typical values) IRM[Tj] / IRM[Tj=25C] 100 VR = 5V 100 IRM[Tj] / IRM[Tj=25C] VR = 5V 10 10 Tj(C) 1 25 50 75 100 125 1 25 50 Tj(C) 75 100 125 Figure 3. Remaining voltage after Figure 4. DSILC6-4P6 during ESD 15 kV positive surge (air discharge) 10 V/div Remaining voltage after DSILC6-4F2 during ESD 15 kV positive surge (air discharge) 10 V/div 50 ns/div 50 ns/div Figure 5. Remaining voltage after Figure 6. DSILC6-4P6 during ESD 15 kV negative surge (air discharge) 5 V/div Remaining voltage after DSILC6-4F2 during ESD 15 kV negative surge (air discharge) 5 V/div 50 ns/div 50 ns/div 3/11 Characteristics DSILC6-4XX Figure 7. Frequency responses of all lines DSILC6-4P6 S21(dB) Figure 8. Frequency response of all lines DSILC6-4F2 S21 (dB) 0.00 0.00 - 5.00 - 5.00 - 10.00 - 10.00 - 15.00 - 15.00 - 20.00 F(Hz) - 20.00 100.0k - 25.00 F (Hz) 100.0M Line 2 Line 4 1.0G 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M Line 2 Line 4 1.0G 3.0G 1.0M Line 1 Line 3 10.0M Line 1 Line 3 Figure 9. Crosstalk results for lines 1/2 and 1/3 DSILC6-4P6 S21(dB) Figure 10. Crosstalk results for lines 1/2 and 1/3 DSILC6-4F2 0.00 0.00 - 20.00 - 40.00 - 60.00 - 80.00 - 100.00 - 120.00 S21 (dB) - 20.00 - 40.00 - 60.00 - 80.00 - 100.00 - 120.00 F(Hz) - 140.00 100.0k - 140.00 F (Hz) 1.0G 1.0M Xtalk 3.0M 1/2 10.0M 30.0M 100.0M 300.0M Xtalk 1/3 1.0G 3.0G 1.0M Xtalk 1/2 10.0M 100.0M Xtalk 1/3 4/11 DSILC6-4XX Application examples 2 2.1 Application examples MDDI Lower Clamshell Upper Clamshell Hinge Analog Earpiece Audio Power Data+ DataStrobe+ Strobe- Power DSILC6-4XX MDDI Data (Host) MDDI Strobe (Host) Base band IC GND GND MDDI Client & LCD Controller Chip (With Frame Buffer) PRIMARY LCD SECONDARY LCD 2.2 SMIA DATA1+ DATA1- DSILC6-4XX CLOCK+ CLOCK- SMIA device SCL SDA ESDALC6V1P3 5/11 Application examples DSILC6-4XX 2.3 Ethernet 1 Gb +5V SMP75-8 BI_DA+ BI_DA- SMP75-8 BI_DB+ BI_DBDSILC6-4XX +5V DSILC6-4XX DATA TRANSCEIVER SMP75-8 BI_DC+ BI_DC- SMP75-8 BI_DD+ BI_DD- 2.4 USB 2.0 + 3.3V DEVICEUPSTREAM RPU TRANSCEIVER SW2 VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS - + 5V USB connector Protecting Bus Switch HUBDOWNSTREAM TRANSCEIVER SW1 VBUS D+ DRS RS RPD USBLC6-2SC6 VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS - GND RS RS RPD GND TX LS/FS + TX LS/FS - + 3.3V DEVICEUPSTREAM RPU TRANSCEIVER SW2 VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS - SW1 USB connector VBUS D+ DRS RS USBLC6-2P6 RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS - GND RS GND TX LS/FS + DSILC6-4XX RPD RS RPD TX LS/FS - Mode Low Speed LS Full Speed FS High Speed HS SW1 Open Closed SW2 Closed Open Closed then open Open 6/11 DSILC6-4XX Ordering information scheme 3 Ordering information scheme DSI Product Designation Low capacitance Breakdown Voltage 6 = 6 Volts Number of lines protected 4 = 4 lines Packages P6 = SOT-666 F2 = Flip-Chip LC 6-4 xx 7/11 Package information DSILC6-4XX 4 Package information Epoxy meets UL94, V0 SOT-666 Dimensions Dimensions b1 L1 Table 3. Ref. Millimeters Min. Typ. Max. Min. Inches Typ. Max. 0.024 0.007 0.013 L3 b A A3 b D E1 0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27 0.60 0.018 0.18 0.003 0.34 0.007 b1 D 0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051 A E L2 E A3 E1 e L1 L2 e L3 Figure 11. SOT-666 footprint 0.50 Figure 12. SOT-666 marking 0.62 2.60 G 0.99 0.30 8/11 DSILC6-4XX Figure 13. Flip-Chip Dimensions 650 m 65 500 m 50 Package information 500 m 50 1.1 mm 50 m 315 m 50 Figure 14. Flip-Chip footprint Copper pad Diameter : 220m recommended Solder stencil opening : 330m recommended 1.57 mm 50m Figure 15. Flip-Chip marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder mask opening recommendation : 300m recommended xxz y ww Figure 16. Flip-Chip tape and reel specifications Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 9/11 Ordering information DSILC6-4XX 5 Ordering information Ordering code DSILC6-4P6 DSILC6-4F2 Marking G EI Package SOT-666 Flip-Chip Weight 2.9 mg 2.22 mg Base qty 3000 5000 Delivery mode Tape and reel Tape and reel 6 Revision history Date 10-Aug-2006 04-Jan-2007 Revision 1 2 Initial release. Added Flip-Chip package. Added applications examples for SMIA, Ethernet 1 Gb, and USB. Updated Tj max to 150. Added VRM line in Table 2. Modified MDDI example figure. Modified Functional diagram on page 1 to show Top side view instead of Bump side view of DSILC64F2. Removed VRM line in Table 2. Added characteristic curves specific to each package for ESD, Frequency response and Crosstalk Description of Changes 28-May-2007 3 10/11 DSILC6-4XX Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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